Ordinary microwave boosted for baking chips at 2nm

Cornell University researchers have managed to improve an important semiconductor manufacturing process with modified ordinary microwave ovens. The paper shows that the microwaves of a microwave can be used to properly ‘fuse’ the materials of a chip.

To get even more detailed, the smaller the process, the higher the concentration of phosphorus in the mixture must be for a major component of semiconductors. In contrast, according to one of the researchers, manufacturers are reaching the limit of phosphorus density; it would take an ‘unnatural concentration’ for a properly functioning semiconductor on the tiny 2nm scale. As a result, manufacturers no longer consistently get the correct concentration of phosphorus baked into semiconductors. This is where the new heating technology comes in.

Now you might think that someone has probably put a semiconductor in the making in a microwave oven before, and they have. The problem, however, was that regular microwaves heat a semiconductor inconsistently, just like your lasagna. The researchers have therefore not developed a new process so much as an improved microwave machine that evenly heats the combination of phosphor and silicon.

The idea came from chip maker TSMC, Tom’s Hardware notes, and has now become reality in the lab. In cooperation with the Taiwanese chip manufacturer and the Ministry of Science and Technology of Taiwan, the scientists have realized the new heating technology. It is not clear whether the technique can be easily scaled up and whether TSMC will use the special microwaves. It is also not known whether food can be heated better, faster and above all more evenly with the microwaved microwaves!

Sources: Cornell University, via Tom’s Hardware

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